Book a call← All processesCAPABILITY
Nonstandard dicing, resizing, trimming, and feature formation for active wafers and device substrates.
Shape active device wafers, open sensor and MEMS features, resize photonic substrates, form isolation cuts, and create nonstandard die geometries with programmable, contact-free toolpaths.
Discuss this capability ↗GOOD-FIT EXAMPLES
- +Active wafer resizing
- +Device wafer dicing
- +MEMS feature opening
- +Photonics substrate trimming
- +Nonstandard die geometries
MATERIALS
- +Silicon
- +Glass
- +Quartz
- +Sapphire
- +Compound semiconductors
- +Active device wafers
FROM FEATURE TO PROCESSPrototype the feature.
Prototype the feature.
Qualify the process.
Send the material stack, drawing, target geometry, quantity, and surface requirements for a process and inspection plan.
Book a call ↗