← All processesCAPABILITY

Maskless selective ablation, thin-film patterning, and functional surface texturing.

Remove coatings and metallization, isolate conductive layers, expose buried materials, write sensor patterns, and texture functional surfaces with programmed depth and geometry.

Discuss this capability
GOOD-FIT EXAMPLES
  • +Metal film patterning
  • +Coating removal
  • +Sensor patterning
  • +Transparent conductive films
  • +Localized material removal
MATERIALS
  • +Metal films
  • +Coatings
  • +Transparent substrates
  • +Polymer films
  • +Electrode stacks
  • +Composite laminates
FROM FEATURE TO PROCESS

Prototype the feature.
Qualify the process.

Send the material stack, drawing, target geometry, quantity, and surface requirements for a process and inspection plan.

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